Placement

NPM-W2

The NPM-W2 combines accurate component placement, precise SPI and AOI inspection and reproductive adhesive dispensing in one high-speed solution.

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Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.

This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.

In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
 

Features

The multifunctional NPM-W2 is equipped with a 16-nozzle head and can place 42,000 components. 120 feeders can be mounted.

Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.

As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.

Key features of NPM-W2

Key features

Higher productivity and quality with printing, placement and inspection process integration
Versatility for large PCBs and components
5M* process control “APC-5M” for good production and stable operation * 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement
Various skill-less and manpower-saving features including Auto Setting Feeder

Specifications of NPM-W2

Specifications table

PCB dimensions (mm)Single conveyor Batch mounting:L 50 mm × W50 mm ~ L 750 mm × W 550 mm 2-positin mounting:L 50 mm × W50 mm ~ L 350 mm × W 550 mm Dual conveyor Dual transfer ( Batch ):L 50 mm × W50 mm ~ L 750 mm × W 260 mm Dual transfer ( 2-positin ):L 50 mm × W50 mm ~ L 350 mm × W 260 mm Single transfer ( Batch ):L 50 mm × W50 mm ~ L 750 mm × W 510 mm Single transfer ( 2-positin ):L 50 mm × W50 mm ~ L 350 mm × W 510 mm
Placement Head max Speed42 000 cph ( 0.086 s / chip ) 35 000 cph ( 0.103 s / chip )
Placement Head Placement Accuracy (Cpk≧1)±40 μm / chip ±30 μm / chip